PC

Accessory Compatibility

	Recommended	Not Recommended
Build Plate	Engineering Plate, High Temperature Plate or Textured PEI Plate	Cool Plate
Hotend	All Size / Material	/
Glue	Glue Stick	Bambu Liquid Glue

RFID for Intelligent Printing

All printing parameters are embedded in RFID, which can be read through our AMS (Automatic Material System).

Load and print! No more tedious setting steps.

Recommended Printing Settings
Drying Settings (Blast Drying Oven)	80 °C，8h
Printing and Keeping Container's Humidity	< 20% RH (Sealed, with Desiccant)
Nozzle Temperature	260 - 280 °C
Bed Temperature (with Glue)	90 - 110 °C
Printing Speed	< 300 mm/s

Physical Properties
Density	1.20 g/cm³
Vicar Softening Temperature	119 °C
Heat Deflection Temperature	117 °C
Melting Temperature	228 °C
Melt Index	32.2 ± 2.9 g/10 min

Mechanical Properties
Tensile Strength	55 ± 4 MPa
Breaking Elongation Rate	3.8 ± 0.3 %
Bending Modulus	2310 ± 70 MPa
Bending Strength	108 ± 4 MPa
Impact Strength	34.8 ± 2.1 kJ/m²

Downloads

Filament TDS

Filament MSDS

Filament RoHS

Printing Tips:

• Due to the transparent properties of the filament, Lidar Extrusion Calibration can be affected when printing Transparent PC.

• Bambu PC needs proper drying before printing, recommended drying temperature is 80 ℃ for 8 hours in a blast drying oven, or 100 ℃ for 12 hours on a printer's heatbed. For more details please refer to: Filament drying cover on WIKI.